The Equipment has the capability to Manual Wedge Wire Bonder with adjustable height (60mm) with Heater stage (250 degree Celsius). It has the ability to bond using Aluminium (Al) or Gold (Au) wires> The equipment can be used for bonding the devices with the measurement pad

The semiconductor parameter analyser integrates multiple measurement and analysis capabilities to perform the current‐voltage (I-V) and capacitance measurements [C-V (capacitance‐voltage), C‐f (capacitance-frequency), and C‐t (capacitance-time)] accurately.

The equipment acquires brain signal from 64 scalp locations and provides raw EEG data for processing and analysis.It is Capable of analysing motor and cognitive brain activities.

Performing Raman measurements in the range of 10 cm-1 (or lower) to 5000 cm-1 (or higher) with a resolution of 0.5 cm-1 or better with suitable optics.
Performing photo-luminescence measurements in the range of 300 nm (or lower) to 1050 nm (or higher) with a resolution better than 0.1 nm.
Performing confocal Raman Imaging/Mapping with a spatial resolution of 100 nm (or better) on a large area of 0.5 mm x 0.5 mm (or higher).
Performing photo-luminescence measurements in the range of 300 nm (or lower) to 1050 nm (or higher) with a resolution better than 0.1 nm.
Performing temperature dependent Raman and PL measurements down to 77 K with ultra-low vibrations, and for measurements above room temperature up to 800 K (or higher) using a suitable heating stage. The temperature-controlled stage is equipped with 4 probes for simultaneous electrical transport measurements.

9kW system
Characterization of the material crystal structure as well as the effect of impurities, strain, meso-structural ordering, particle size.
The system allows characterization of thin films, powders at large and low incident angles and has attachment for characterization at high temperatures (1500 C).
Residual Stress and Pole figure analysis.

Capable of measuring hardness of the materials using with Rockwell Superficial Rockwell Brinell, Vickers Knoop techniques
Highest load capacity of 250 kgf.

Equipped with Auto sampler capable of injecting from 0.1 to 100 microliters of Sample in an automated manner with utmost accuracy
Near Zero sample Carry over to avoid cross contamination
Fastest scan speed (30,000 u/s) and polarity switching time (5 ms).

LC is combined with Photo Diode Array detector (PDA). It has three-dimensional projection over entire UV-VIS range. It is non-destructive detector so it can be put in series like LC-PDA Mass Spectrometer.
Ion Trap MS/MS Function : The LC is connected to MS and can be analysed.
Fastest scan speed (30,000 u/s) and polarity switching time (5 ms).
High-speed acquisition benefits the laboratory by reducing run times for increased throughput, and also shortens method development time.

Operating with a permanent cryogen free Magnet of field strength of 60 MHz , 1.4 T.
Available with automated flow cell accessory .
Operating temperature 18 to 26 degree Celsius

Simultaneous analysis of TG with DTA mode and DSC mode for fast enhanced result interpretation.
Vertical displacement balance sensor provides weight insensitivity to sample position, no spurious weight change from melting.
Equipped with Mass analyser through Hyphenated technology enables Measurement of gases evolved from samples being tested by a thermal analyser. The Specifications of MS
Ionisation Type Electron Ionisation
Signal to Noise ratio 800: 1
Turbo molecular pump of capacity 255L/sec