To measure the surface features (Roughness parameters, topography, height variation, material loss, etc) with 3-dimensional imaging
Max. Scan Range: Up to 10 mm
Lateral Resolution: 0.38 µm min
Max Scan Speed: 47 µm/sec

To examine metallic/non-metallic specimens’ microstructure at 2000000 X magnification with the resolution of 0.8nm at 15 kV; 1.3 nm at 1 kV
EDS (EDAX-make) attachment to detect its chemical composition
EBSD (EDAX-make) attachment to analyse the texture (orientation) of microstructure of metallic components

Lithography - Raith Lithography system (ELPHY Multibeam 20 MHz ) with Zeiss Electrostatic beam blanker attachment for electronic micro device fabrication

A fully Automated dynamic flow Adsorption/desorption analyzer capable of performing pulse chemisorption and temperature programmed desorption studies of reactive gases and vapors on solids
Capable of studying from ambient to 1100 °C
Temp ramp rate from 10 °C / Min. to 30 °C/min.
Capable doing Following Studies : Temperature Programmed Desorption(TPD), Temperature Programmed Oxidation (TPO), Temperature Programmed Reduction (TPR).