Wire Thermionic Bonder
The Equipment has the capability to Manual Wedge Wire Bonder with adjustable height (60mm) with Heater stage (250 degree Celsius). It has the ability to bond using Aluminium (Al) or Gold (Au) wires> The equipment can be used for bonding the devices with the measurement pad
Location
CIF Lab ,Nila Campus
Faculty In-Charge
Contact Details
cif-cmff@iitpkd.ac.in
Section
Equipment Title
